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Intel
5SGXMA4H2F35I3LN ImageView larger image
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5SGXMA4H2F35I3LN

Manufacturer Part Number:
5SGXMA4H2F35I3LN
Manufacturer / Brand
Intel
Part of Description:
IC FPGA 600 I/O 1152FBGA
Datasheets:
5SGXMA4H2F35I3LN(1).pdf5SGXMA4H2F35I3LN(2).pdf5SGXMA4H2F35I3LN(3).pdf5SGXMA4H2F35I3LN(4).pdf5SGXMA4H2F35I3LN(5).pdf5SGXMA4H2F35I3LN(6).pdf5SGXMA4H2F35I3LN(7).pdf5SGXMA4H2F35I3LN(8).pdf5SGXMA4H2F35I3LN(9).pdf5SGXMA4H2F35I3LN(10).pdf5SGXMA4H2F35I3LN(11).pdf5SGXMA4H2F35I3LN(12).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

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Part Number 5SGXMA4H2F35I3LN
Manufacturer / Brand Intel
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 600 I/O 1152FBGA
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 0.82V ~ 0.88V
Total RAM Bits 37888000
Supplier Device Package 1152-FBGA (35x35)
Series Stratix® V GX
Package / Case 1152-BBGA, FCBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 420000
Number of LABs/CLBs 158500
Number of I/O 600
Mounting Type Surface Mount
Base Product Number 5SGXMA4

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



5SGXMA4H2F35I3LN Product Details:

Integrating complex designs with ease and flexibility, the 5SGXMA4H2F35I3LN is an innovative product in the world of Embedded-FPGAs. Being an IC FPGA, this product has a model number of 5SGXMA4H2F35I3LN that packs in an array of features and performance parameters to ensure that it meets a wide range of design needs that designers face. With over 600 I/O, the 5SGXMA4H2F35I3LN integrated circuit is a field programmable gate array enabling designers to customize it for their product designs with exceptional flexibility. With its high-density performance, it can accommodate a broad range of digital, analog, mixed-signal, and RF functions to ensure a smooth integration with various electronic devices. The 5SGXMA4H2F35I3LN is built to give the best performance and reliability to industries and specialized applications. Industries and specific applications that can benefit from its design include the automotive, medical, defense, and aerospace industries. The product can also be used in high-end computing, networking, and datacom applications. Talking about its performance parameters, the 5SGXMA4H2F35I3LN delivers outstanding accuracy and efficiency through its output voltage, current, power, and temperature range. Its performance parameters are optimized to support even the most sensitive applications and ensure that the device operates optimally across a wide range of environmental conditions. The manufacturing process of this Embedded-FPGAs IC is complex, including chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, vapor deposition, etching, and more. The process is done to ensure that it meets the highest standards and complies with industrial and academic requirements. Once the manufacturing process is complete, finished products need to undergo appropriate packaging and testing to ensure component quality. This ensures that the product is of high quality and capable of meeting the unique requirements of different applications. In conclusion, the 5SGXMA4H2F35I3LN Embedded-FPGAs IC is an innovative product that meets a wide range of design needs. With its high-density performance, it delivers exceptional flexibility, accuracy, and reliability to fit into different application scenarios and perform optimally even in the most complex environments.

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