It is intended to conform to rough surface irregularities, displace air gaps, and take up manufacturing tolerances on. Bond lines as thin as 150μm can be accommodated.
Urethane-based ‘GEL 40NS’ is a one-component low-outgassing (0.18% mass, 0.03%CVCM) material with 4W/m.K thermal conductivity that needs no secondary curing. Operation is over -50 to +100°C.
Dielectric constant is 4.8 (100kHz) and volume resistivity is 1014Ωcm
“Users will discover a thermally reliability material in an low compression force package,” said the company. “It deforms easily under assembly pressure, minimising stress on components, solder joints and leads. The fully-cured and dispensable product requires no mixing.”
The material is available in containers ranging from 10cc syringes to 3.8 litre pails, and is expected to be used in high-volume automated assembly as well as for rework and field repair.
GEL 40NS reliably conforms to rough surface irregularities, displaces air gaps and takes up manufacturing tolerances on heat-generating components. The product provides very low thermal impedance at bond lines as thin as 0.15 mm (0.006”).
The GEL 40NS product page can be found here